#printed electronics

Printed electronics use standard printing techniques to manufacture electronic devices on different substrates like glass, plastic films, and paper. Interest in this area is growing because of the potential to create cheaper circuits more efficiently than conventional methods. A new study by researchers at Soonchunhyang University in South Korea, published in AIP Advances, provides insights into the processing of copper nanoparticle ink with green laser light.

Kye-Si Kwon and his colleagues previously worked with silver nanoparticle ink, but they turned to copper (derived from copper oxide) as a possible low-cost alternative. Metallic inks composed of nanoparticles hold an advantage over bulk metals because of their lower melting points. Although the melting point of copper is about 1,083 degrees Celsius in bulk, according to Kwon, copper nanoparticles can be brought to their melting point at just 150 to 500 C—through a process called sintering. Then, they can be merged and bound together.

Kwon’s group concentrates on photonic approaches for heating nanoparticles by the absorption of light. “A laser beam can be focused on a very small area, down to the micrometer level,” explained Kwon and doctorate student Md. Khalilur Rahman. Heat from the laser serves two main purposes: converting copper oxide into copper and promoting the conjoining of copper particles through melting.

A new form of electronics manufacturing which embeds silicon nanowires into flexible surfaces could lead to radical new forms of bendable electronics, scientists say.

In a new paper published today in the journal Microsystems and Nanoengineering, engineers from the University of Glasgow describe how they have for the first time been able to affordably ‘print’ high-mobility semiconductor nanowires onto flexible surfaces to develop high-performance ultra-thin electronic layers.

Those surfaces, which can be bent, flexed and twisted, could lay the foundations for a wide range of applications including video screens, improved health monitoring devices, implantable devices and synthetic skin for prosthetics.

The paper is the latest development from the University of Glasgow’s Bendable Electronics and Sensing Technologies (BEST) research group, led by Professor Ravinder Dahiya.