#semiconductors
1. The American Edward Goodrich Acheson heated a mixture of clay – aluminium silicate, and powdered coke (carbon) in an iron bowl with a carbon arc, and found shiny hexagonal crystals attached to the carbon electrode. Acheson eventually patented this method for producing powdered silicon carbide (SiC), a compound of silicon and carbon in 1893.
2. The mineral form of silicon carbide is called moissanite and gets its name from Dr Ferdinand Henry Moissan, who first discovered it in the Canyon Diablo Crater in Arizona in 1904.
3. Silicon carbide crystals can be strongly birefringent, meaning the crystals exhibit different refractive indices down different axes.
4. SiC powder production involves the Acheson resistance furnace, produced by the Lely Process. This method creates large single crystals by sublimating silicon carbide powder to form a high-temperature species called silicon dicarbide (SiC2) and disilicon carbide (Si2C).
5. Semiconducting silicon carbide first found application as a detector in early radios at the beginning of the 20thCentury.
To find out more about the history of silicon carbide, read Anna Ploszajski’s Material of the Month feature in our January issue.
Search for new semiconductors heats up with gallium oxide
University of Illinois electrical engineers have cleared another hurdle in high-power semiconductor fabrication by adding the field’s hottest material – beta-gallium oxide – to their arsenal. Beta-gallium oxide is readily available and promises to convert power faster and more efficiently than today’s leading semiconductor materials – gallium nitride and silicon, the researchers said.
Their findings are published in the journal ACS Nano.
Flat transistors have become about as small as is physically possible, but researchers addressed this problem by going vertical. With a technique called metal-assisted chemical etching – or MacEtch – U. of I. engineers used a chemical solution to etch semiconductor into 3D fin structures. The fins increase the surface area on a chip, allowing for more transistors or current, and can therefore handle more power while keeping the chip’s footprint the same size.
Developed at the U. of I., the MacEtch method is superior to traditional “dry” etching techniques because it is far less damaging to delicate semiconductor surfaces, such as beta-gallium oxide, researchers said.
“Gallium oxide has a wider energy gap in which electrons can move freely,” said the study’s lead author Xiuling Li, a professor of electrical and computer engineering. “This energy gap needs to be large for electronics with higher voltages and even low-voltage ones with fast switching frequencies, so we are very interested in this type of material for use in modern devices. However, it has a more complex crystal structure than pure silicon, making it difficult to control during the etching process.”