A sputter system in our lab.
Sputter deposition is a fabrication technique used to deposit thin films of a particular material onto a sample. The film can then be patterned using lithography into, for example, electrical contacts for your device. It is commonly used in the semiconductor industry to make integrated circuits.
First a gaseous plasma of ions, typically argon, is created in the sputter chamber. Ions in the plasma are then accelerated into a large piece of the material to be deposited, called the target, causing atoms to be ejected from the surface. Atoms that reach the sample or substrate are redeposited, forming a thin film over time.